Chip on Chip

Chip on Chip, or Package on Package (PoP) is an emerging technology whereby one component is placed directly onto pads on the top of a previously placed component.

Over the last year we have taken time to obtain samples, attend SMART group conferences, review process requirements with Siemens and so on.  As a result we are in a position to assemble these types of devices as and when the need arises.

However, we would recommend that prior to finalising a layout you discuss the manufacturability of these parts and your product as our success will be greatly influenced by your design.